Ironwood Electronics, the go-to source for advanced adapters, sockets, and modules, has developed a new test socket for BGA devices including large array ASIC’s and the smallest I/O and down to 0.35 mm pitch. The Grypper socket can be designed to any I/O count specific to a custom BGA requirement for characterization, validation and failure analysis.
The Ironwood Grypper G80 LIF socket allows testing of an 896 I/O – 31.0 x 31.0 0.80mm pitch BGA package. The small Grypper socket is a 12-ball socket at 0.40 pitch. This BGA device size is only 1.2 X 1.6 mm. This design also incorporates built in alignment corners making it easy to position the small BGA to the socket prior to insertion. To connect a device, simply insert into the socket by pressing on top of the device, no lid is required. The unique geometry of the contact grips onto the solder balls of the device. To remove the device a simple extraction tool can be used to pop the device back out of the socket and it is ready to install another device.
This Grypper socket has excellent electrical performance with an insertion loss of 1 dB at a frequency greater than 40 GHz. Force required to insert a device is 25 grams / contact. The socket is sold in three configurations; Sockets with a Rohs solder ball (SAC 305) replicates the device. The socket configured with SnPb solder ball allow easy reflow/attachment onto a PCB that already has components mounted. The lower melting temperature of the SnPb solder will not affect any adjacent components that might be close to the target area where the socket is to be placed. The socket can also be purchased with NO solder balls. Non solder ball version requires the use of a 0.2mm thick stencil for the correct amount of solder paste allowing any type of solder paste the customer’s lab might use for attachment.