IPP Introduces Cool Chips for Efficient Heat Transfer in Electronic Devices


IPP Introduces Cool Chips for Efficient Heat Transfer in Electronic Devices

Innovative Power Products (IPP) has developed an Aluminum Nitride ceramic chip that can be used to transfer heat. IPP’s Cool Chip is designed to draw heat from one location that is too hot and move it to a different location that can absorb the heat. These devices are manufactured on a highly thermally conductive ceramic substrate (Aluminum Nitride) that is electrically isolated and safe to use. The terminals are gold-plated over nickel, making them easy to solder with many different alloy types. These devices are ideal for small, compact areas with high heat concentrations, intended for both military and commercial applications. Cool Chips are made in the USA with the same high quality that IPP is known for.

Thermal Testing Shows Significant Reduction in Temperature Using Cool Chip

The thermal images below are from actual tests taken with IPP’s Cool Chips. These images show the heat generated from a resistor that is mounted on a PCB that has a dielectric constant of 2.20 and a thermal conductivity of 0.20 (W/mK). The Aluminum Nitride substrate has a thermal conductivity of 170 W/mK.

Results with One Cool Chip

After installing one Cool Chip, as shown above, with one side soldered to a heat sink, the temperature of the resistor changed as follows

Results with Two Cool Chips

After installing two Cool Chips as shown above, with one side soldered to a heat sink, the temperature of the resistor changed as follows:

Cool Chips can be used in a wide range of applications including PIN and Laser Diodes, RF Amplifiers, Capacitors, Transistors, Power Supplies, Filters and Resistors. Click here to learn more about IPP’s cool chips.



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