Signal Microwave Introduces New Solderless Top Launch Connector that Operates up to 50 GHz


Signal Microwave Introduces New Solderless Top Launch Connector that Operates up to 50 GHz

Signal Microwave, a design and manufacturing company that develops RF/microwave connectors and test boards for the signal integrity/high-speed digital market, and 5G mmWave, has introduced TLF50, a new connector product that is part of the top launch connector series, thereby expanding its connector portfolio. This connector can be connected on the top of the PC board and delivers edge launch type performance, even when it is connected anywhere on the board.

The unique feature of TLF50 is that it does not require to be soldered to the board, which eliminates the labor time and cost and accelerates time-to-market. The below table shows the VSWR and insertion loss performance of the TLF50 connector up to 50 GHz.

Typical data for 2 connectors tested on a GCPW test board

Key Features of theĀ TLF50 Top Launch Connector

  1. 2.40 mm Interface
  2. Top RF launch to 50 GHz
  3. Compression Contact
  4. No Soldering Required
  5. Transitions to a microstrip or grounded coplanar line on the top layer of the board
  6. Signal does not need to travel through the board vias

Click here to learn more about TLF50 connector.

Click here to learn more about Signal Microwave’s top launch connector portfolio.

Signal Microwave is showcasing this connector along with its RF Interconnect range at IMS 2024 in Washington DC this week. Stop by their booth to learn more. Click here to see everything RF’s coverage of IMS 2024.



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