Microchip’s RTG4 FPGAs with lead-free flip-chip bumps have achieved QML Class V qualification, the highest level for space components. This status, designated by the Defense Logistics Agency, ensures exceptional reliability and longevity for critical space missions. QML Class V-qualified products also help customers streamline their design and certification processes.
According to Microchip, the RTG4 radiation-tolerant FPGA with lead-free flip-chip bumps is the first of its kind to gain QML Class V status. Flip-chip bumps are used to connect the silicon die and the package substrate, while the lead-free material extends the longevity of the product. The flip-chip bump is contained within the FPGA package, so converting to these new RTG4 FPGAs has no impact on the user’s design, reflow profile, thermal management, or board assembly process.
With a flash-based fabric, RTG4 FPGAs deliver high density and performance for space applications, consuming significantly less power than equivalent SRAM-based FPGAs. They also exhibit zero configuration upsets in radiation environments, eliminating the need for mitigation measures.
The RTG4 FPGAs are supported by development kits, mechanical samples, and daisy chain packages for board validation and testing. To learn more, click the product page link below.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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