Engineers developing military and space systems are encouraged to participate in the future of military and space systems! The 28th Annual Components for Military and Space Electronics (CMSE) Conference and Exhibit has locked in an electrifying program of keynotes, technical sessions and tutorials, designed to ignite your passion for next-gen component engineering. Mark your calendars for April 29-May 1, 2025, with exhibits lighting up April 30 and May 1. This is your chance to dive into the technologies powering tomorrow’s satellites, military defense platforms and deep-space missions.
This year’s theme, “Component Engineering for Next-Generation Electronic Components and New Technology Insertion,” zeroes in on the critical supply chain challenges and breakthroughs driving military, defense and space applications. Expect a deep dive into ruggedized microelectronics, advanced packaging and high-reliability solutions engineered to withstand the harshest environments — perfect for those building systems that operate beyond the atmosphere or on the battlefield.
Media Sponsors this year include everythingRF, COTS Journal, Microwave Journal, Test Assembly & Packaging Times SATNOW, EMC Directory, EPCI European Passive Components Institute, MEPTEC, HOW2POWER, MEMS Journal and RTC magazine.
DAY 1 — April 29: Master the Fundamentals
Kick off with hands-on tutorials led by industry titans:
- Tutorial 1: “Microelectronic Component Engineering Principles and Practices”
- Instructors like Thomas J. Green (T.J. Green Associates), Ron Demcko (Kyocera/AVX), Trevor Devaney (Hi-Rel Laboratories) and Jon Rhan (Vishay Intertechnology) will unpack the core of designing components that thrive under extreme conditions — essential for satellite and missile systems.
- Tutorial 2: “Design and Test of Non-Hermetic Microelectronics for Military and Space”
- Thomas J. Green and Jeff Gotro, Ph.D. (InnoCentrix LLC), reveal how to push non-hermetic designs to their limits, a game-changer for lightweight, high-performance space hardware.
- Tutorial 3: “Military Standards Unraveled + JEDEC/NewSpec Updates”
- Hear from Lawrence Harzstark (Aerospace Corp.), Sultan Lilani (Integra Technologies), Shri Agarwal (NASA JPL), and Rod de Leon (Boeing) as they decode the latest standards and initiatives shaping space-grade electronics compliance.
DAY 2 — April 30: Visionary Keynotes and Tech Deep Dives
- Keynote I: “Northrop Grumman’s Next-Gen Packaging Revolution”
- Louise Sengupta, Ph.D., Director of Business Development at Northrop Grumman Microelectronics Center, will showcase how cutting-edge packaging technologies are redefining performance for military and space platforms utilizing heterogeneous chip integration and beyond.
- 30+ Presentations : From advanced packaging to high-reliability Polymer & MLCC capacitors, explore sessions on microelectronic design, development and packaging tailored to high-stakes applications.
DAY 3 — May 1: The Future of Space-Ready EEE Parts
- Keynote II: “Evolution of EEE Parts for Space Missions”
- Larry Harzstark, Technical Fellow at The Aerospace Corporation, will trace the journey of electrical, electronic and electromechanical (EEE) components, revealing how they’re evolving to meet the demands of next-gen space exploration.
- Exhibits in Full Force : Connect with over 40 exhibitors — including Kyocera-AVX, Vishay, Hi-Rel Labs, Q-Tech, Vishay, Yageo-Kemet, RFHI , Agile Microwave Technology, ES
- Components — who are ready to demo Hi-Rel components, microelectronic services and equipment built for your mission-critical projects. A few exhibit spots remain — act fast!
Why You Can’t Miss This
Last year, attendees raved about the unmatched networking with exhibitors and peers solving real-world challenges in military and space tech. Held at the Four Points Marriott in Los Angeles, near LAX Airport (with exclusive attendee rates), this is your hub to swap ideas, uncover solutions and forge connections with the brightest minds in the field.