Bluetooth 6.0 modules target varied applications



KAGA FEI is expanding its Bluetooth LE portfolio with two Bluetooth 6.0 modules that offer different memory configurations. Like the existing EC4L15BA1, the new EC4L10BA1 and EC4L05BA1 are based on Nordic Semiconductor’s nRF54L series of wireless SoCs and integrate a built-in antenna.

The EC4L15BA1 offers the highest memory capacity, with 1.5 MB of NVM and 256 KB of RAM. For applications with lighter requirements, the EC4L10BA1 includes 1.0 MB of NVM and 192 KB of RAM, while the EC4L05BA1 provides 0.5 MB of NVM and 96 KB of RAM. This range enables use cases from industrial IoT and healthcare to smart home devices and cost-sensitive, high-volume designs.

The multiprotocol modules support Bluetooth LE, Matter, Thread, and a 4- Mbps data rate for 2.4 GHz proprietary protocols. They feature PSA Level 3 certification for strong hardware and software protection and are pre-certified for MIC (Japan), FCC (USA), and ISED (Canada) to simplify IoT integration. Bluetooth 6.0 compatibility adds Channel Sounding for precise distance and direction measurements.

Samples of the EC4L10BA1 and EC4L05BA1 will be available in October 2025. Mass production is scheduled to begin in January 2026.
 

EC4L10BA1 product page 

EC4L05BA1 product page 

KAGA FEI

The post Bluetooth 6.0 modules target varied applications appeared first on EDN.



Source link