TTM Technologies delivers cutting-edge RF and microwave printed circuit boards (PCBs) and components that serve a wide range of industries, from defense, space, and aerospace electronics to medical devices, advanced imaging systems, complex telecommunications equipment, 5G enablement, and millimeter-wave automotive radar. Supporting frequency bands that span L, S, C, X, Ku, K, Ka, V, and W, TTM brings deep expertise in low-loss laminate materials and offers more than 70 resin systems to meet stringent performance requirements.
Driven by a commitment to innovation, TTM invests heavily in research and development to provide customers with comprehensive data on signal integrity, materials, and high-reliability design-for-manufacture guidance. Its dedicated Signal Integrity Lab works closely with customers to ensure that RF and microwave applications meet market needs and the demanding standards for quality and reliability required across critical industries.
TTM‘s one-stop manufacturing capabilities support the entire product lifecycle—from new product introduction to end-of-life. The company offers engineered thermal solutions, high-current testing, low-temperature cofired ceramics (LTCC) solutions, microwave attenuators, and other advanced technologies that add value at every stage. Rigorous testing protocols and adherence to internationally recognized quality and environmental standards have earned TTM the trust of leading global brands.
Advanced Capabilities for High-Performance RF and Microwave Applications
TTM maintains tight process tolerances for critical RF features, including a standard ±0.0005″ (12.7 µm) tolerance on etched features for un-plated 0.5 oz copper, selective plated-up layers with the same tolerance, and exact registration with laser direct imaging. The company achieves front-to-back registration of etched cores to ±0.001″ (25.4 µm) and offers hybrid dielectric material constructions, buried and blind vias, microvias, Ormet paste for z-axis interconnects, multi-level cavity constructions, optical milling and drilling, laser routing, sequential lamination, PTFE fusion bonding, formed PCBs, and plated edges and slots.
For precision stub removal, TTM provides multiple backdrilling options, including mechanical back-drilling with minimal stub, laser drilling with no stub, and a hybrid laser-modified controlled-depth process. Hole-fill options include Via-In-Pad-Plated-Over (VIPPO) with conductive or non-conductive epoxy, solid copper-plated microvias, small mechanical drilled plated-through vias, and partial hole-fill techniques.
Thermal management solutions are another TTM specialty. The company integrates copper coins and slugs, HDVP and ThermalVia® technologies, metal core and metal-backed designs, thermally conductive laminates, and a dedicated heatsink assembly department for laminating heatsinks or interface plates to circuit boards.
TTM’s embedded component capabilities encompass planar resistors and capacitors, Ohmega and Ticer solutions, screened ink resistors, planar capacitance materials—laminate, film-based, and high-dielectric-constant (Dk) filled—along with circulators, on-board circuits, embedded ferrites, and other passive components.
A variety of surface finishes are available, including Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Electroless Palladium Immersion Gold (EPIG), hard and soft wire-bondable gold, immersion silver, and organic solderability preservatives (OSP).
Comprehensive RF Assembly and Testing
Completing its end-to-end offering, TTM provides RF assembly for connectors, surface-mount components, and drop-in cavity components, with both manual and automated soldering options. Its RF test centers feature extensive engineering resources and multiple network analyzers covering frequencies up to 110 GHz. TTM also offers RF and microwave dielectric material testing and characterization, 3D laser scanning for copper foil profile analysis, 2D static field solvers, 3D full-wave simulation, custom anechoic boxes for antenna measurements, and switch-matrix capabilities for high-volume measurements with minimal human intervention.
By combining innovative engineering, advanced process capabilities, and rigorous quality standards, TTM Technologies stands as a trusted partner for customers seeking high-performance RF and microwave PCB solutions across the most demanding global markets.