Yole Group releases its annual report, “Status of the Advanced Packaging Industry 2025,” featuring exclusive market ranking and in-depth analysis of leading players.
From 2024 to 2025, the advanced packaging market reinforced its strategic role across markets. Once confined to specific high-end applications, it is now a pillar of mass adoption in consumer electronics and an enabler of emerging markets, including AR/VR, edge AI, aerospace and defense.
At the same time, the telecom & infrastructure segment is experiencing unprecedented growth, with a 14.9 percent increase between 2024 and 2030, making it the segment with the highest growth. This momentum is powered by AI accelerators, GPUs, cloud and data center demand, and chiplet-based architectures. As system complexity rises, advanced packaging technologies such as CoWoS, SoIC, EMIB, I-Cube and 3D stacking provide the performance and integration levels required by hyperscale infrastructure players.
Bilal Hachemi, senior technology and market analyst, Semiconductor Packaging at Yole Group, stated, “Advanced packaging has reinforced its role as a cornerstone within the semiconductor value chain, reshaping not only mass markets but also highly sensitive domains. Its trajectory reflects a portfolio expansion designed to enable a wide spectrum of industries.”
Players, investments and regional strategies in the advanced packaging industry
The 2024 ranking of advanced packaging players highlights a shifting landscape: IDMs dominate with Intel, Sony, Samsung, YMTC and SK Hynix leading, followed by OSATs and foundries such as TSMC. Memory players and diversified portfolios have reshaped the Top 10.
This reshaping has been enabled by a wave of unprecedented investments:
- TSMC ramped CoWoS capacity after acquiring a facility from Innolux in Taiwan and is also scaling SoIC.
- ASE, Amkor and Intel boosted U.S. capacity in line with CHIPS Act incentives, aligning with customer needs from NVIDIA and Apple.
- Unisem and MPI expanded in Malaysia and Vietnam to avoid China–Taiwan tensions and reduce logistics costs.
- Forehope, Lingsen and ChipMOS reinforced their strong mainland China positions, investing heavily in automation and customer clustering.
- JCET announced a $1.5 billion investment to strengthen domestic AP capabilities.
- In Nanjing, HT-Tech launched a second-phase expansion worth 10 billion yuan, about $1.4 billion.
Tongfu Microelectronics announced a 7.5 billion yuan (~$1.0 billion) advanced packaging project targeting flip-chip, multi-layer stacking, WLP and PLP, with completion planned by 2029.
Across Jiangsu, Hubei and other regions, at least seven new advanced packaging fabs are under construction in China, signaling a long-term push for independence and capacity scaling.
What’s next?
“We are witnessing the start of a new cycle for advanced packaging. Market leaders are reshaping their strategies with major investments and alliances to secure growth across consumer, A and infrastructure markets,” stated Bilal Hachemi from Yole Group.
For example, collaboration has become a defining factor for advanced packaging success. Overflow partnerships between TSMC, ASE and Amkor, Intel’s EMIB assembly collaboration with Amkor and regional consortia highlight the necessity of shared innovation. And for disruptive technologies such as CPO , robust collaboration is essential to overcome material and equipment barriers. The supply chain is moving toward resilient, regionalized and vertically integrated ecosystems, reducing reliance on global volume-centric sourcing.
With revenues expected to reach $79.4 billion by 2030, advanced packaging is no longer an optional innovation; it is the foundation of semiconductor growth. From smartphones to data centers, from AI accelerators to defense systems, advanced packaging is positioning itself as the enabling force behind the industry’s transformation, and Yole Group’s analysts will continue their investigation to deliver up-to-date and accurate analyses of this industry week after week.