As semiconductor chip architectures become more complex and performance-driven, the materials enabling advanced packaging are evolving just as fast. Yole Group’s new report, Glass Materials for Advanced Packaging 2025, provides the first in-depth analysis dedicated to the fast-growing glass materials market across multiple packaging platforms, including glass core substrates, glass interposers, glass carriers, TGVs and glass-based emerging technologies. This comprehensive report delivers a complete picture of market dynamics, technology evolution and supply chain strategies shaping glass adoption in advanced packaging.
Yole Group’s analysts examine the market trends and drivers for each major application, along with forecasts for production volumes, panel production and revenues. They also detailed technology roadmaps describing key processes and key manufacturing challenges, the different approaches at each process step, as well as the developing ecosystem in each region. Moreover, Yole Group provides an overview of the supply chain, identifying the key players, their positioning and collaborations and a description of the regional ecosystems in China, Korea and Japan, highlighting local innovation and strategic capabilities.
Glass materials are now entering a high-growth phase, driven by need and demand from data centers, telecommunications and AI/HPC applications. In data centers, glass guarantees the critical packaging vectors for chiplet fabrics and optical I/O, while in telecommunications, low-loss glass stacks are reshaping 5G/6G RF front ends by reducing size, improving thermal behavior and enabling higher frequencies.
The report also highlights how panel-based glass interposers and carriers are becoming essential to large-area packaging and co-packaged optics, as system designers push beyond the limits of traditional silicon and organic substrates.
Key results and industry megatrends
Yole Group’s latest analysis reveals that glass materials are now positioned at the core of the semiconductor packaging revolution, fueled by megatrends such as AI, HPC , 5G/6G connectivity and co-packaged optics. Analysts highlight that glass’s unique properties, including low CTE , superior dimensional stability and optical transparency, make it indispensable for meeting the mechanical, electrical and thermal demands of next-generation packaging.
According to Yole Group, data centers and telecommunications are the main growth engines driving the adoption of glass in packaging, with additional momentum coming from automotive, defense and premium consumer electronics. These sectors increasingly rely on chiplet integration, hybrid bonding and panel-level manufacturing, where glass provides both performance gains and cost advantages. The analysis also identifies the emergence of new supply chains in Asia, especially in China, Korea and Japan, as critical factors in scaling production and strengthening the global glass ecosystem for advanced packaging.
“Glass has quietly moved from a supporting role to a central enabler in advanced packaging. Its mechanical stability, optical transparency and low coefficient of thermal expansion make it ideal for high-density, high-performance integration, exactly what AI, data center
and 5G applications now demand,” said Bilal Hachemi, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
A strategic piece of Yole Group’s packaging expertise
This new report is part of Yole Group’s comprehensive collection of semiconductor packaging market and technology analyses, which includes deep-dive studies and teardown reports covering advanced substrates, interconnects, heterogeneous integration and system-in-package platforms. Yole Group’s analysts have been investigating the evolution of glass in advanced packaging for several years, tracking each step of its transition from a niche support material to a strategic enabler of innovation. Through continuous research and collaboration with key industry players, the team provides ever-deeper insight into how glass technologies are shaping market growth, manufacturing ecosystems and next-generation integration strategies.
With Glass Materials for Advanced Packaging 2025, Yole Group once again demonstrates its expertise in semiconductor materials and packaging analysis, delivering data-driven insights into market trajectories, technology challenges and the business opportunities created by the rise of glass. This new report is part of the semiconductor packaging collection of reports and teardowns.