Microsembly announced that it will exhibit at SATELLITE 2026 (SATShow Week) from March 23 — 26 in Washington, DC, at the Walter E. Washington Convention Center (Booth 2159).
SATShow Week is the satellite industry’s most comprehensive and globally recognized gathering, bringing together commercial leaders, engineers, government and military decision-makers, innovators and end-users for a week of collaboration across the global space and communications ecosystem.
As the space industry accelerates — with commercial satellite constellations, advanced military communications and emerging NewSpace programs demanding mission-critical RF hardware — Microsembly is positioned as a trusted partner helping aerospace and defense leaders transform design concepts into deployment-ready systems.
From Design to Deployment: Owning the Full RF Hardware Journey
At the event, Microsembly will highlight its end-to-end partner services for RF and microwave microelectronics, supporting customers from early engineering through full production, testing and qualification.
What differentiates Microsembly is not just its manufacturing capability, but its ability to eliminate friction across the entire hardware lifecycle — reducing risk, avoiding costly redesigns and accelerating time-to-mission.
Engineering, Prototyping & Production Readiness
Before a single component is assembled, Microsembly works alongside customers to ensure designs are ready for real-world manufacturing.
Through Design for Manufacturability (DFM) analysis, mixed-technology integration planning, thermal management evaluation and structured production readiness reviews, Microsembly aligns materials, processes and qualification pathways early — preventing costly rework and enabling scalable production from the outset.
Device Evaluation, Characterization & Precision Packaging
Not all RF devices behave identically — and assumptions at this stage can introduce major downstream risk.
Microsembly’s advanced evaluation services — including wafer probing, DC parametric testing and tri-temperature MMIC characterization — provide deep visibility into device performance prior to integration. These insights are paired with cleanroom-controlled MMIC packaging and discrete component preparation, ensuring performance is tightly controlled from the start
PCBA Manufacturing & Hybrid Module Assembly
Microsembly delivers sophisticated integrated microwave assemblies (IMAs) using advanced surface mount (SMT) printed circuit board assembly (PCBA), multilayer substrate integration and precision interconnect processes.
Capabilities include eutectic and epoxy die attach, fine-pitch wire bonding and high-density RF module assembly supporting complex mixed-technology builds across GaN, GaAs, SiGe and CMOS platforms — ensuring consistency and performance across production runs.
RF Testing & Environmental Screening
Before hardware reaches orbit or the battlefield, it must perform — and survive.
Microsembly provides module-level RF testing up through millimeter-wave frequencies alongside comprehensive thermal and mechanical environmental screening. Testing is conducted through a combination of in-house capabilities and certified external partners to ensure full compliance with program requirements.
These services verify both electrical performance and long-term reliability under extreme conditions, supporting compliance with standards including:
- MIL-PRF-38534 / 38535
- MIL-STD-750 / 883
- NASA EEE-INST-002
- NASA PEM-INST-001
- Emerging NewSpace qualification frameworks.
Built for Mission-Critical Performance
With more than 20,000 square feet of controlled manufacturing space, ISO 14644-1 Class 7 and Class 8 cleanrooms, and IPC-J-STD-001 certified technicians, Microsembly operates as a disciplined, traceable manufacturing environment for RF microelectronics programs where failure is not an option.
This is not transactional contract manufacturing — it is mission-aligned production designed for aerospace, defense and satellite systems that must perform flawlessly in the harshest environments.
“Satellite and NewSpace programs demand RF hardware engineered for reliability in some of the harshest environments imaginable,” said Kent Dang, President of Microsembly. “Our mission is simple: be the partner our customers trust to handle every detail — from device evaluation and advanced assembly to full RF verification and environmental screening — so their modules are ready for deployment when it matters most.”