Telink TL322X+ML3228A Launched at Embedded World 2026

//php echo do_shortcode(‘[responsivevoice_button voice=”US English Male” buttontext=”Listen to Post”]’) ?>

On March 10th at Embedded World 2026 in Nuremberg, Germany, Telink unveiled its new TL322X series SoC and ML3228A module, introducing a comprehensive wireless connectivity solution for all IoT scenarios with a dual product matrix of “chip + module.” Leveraging its core strengths—high performance, low power consumption, multi-protocol compatibility, and high integration—this product line precisely meets diverse application needs, ranging from true 8K gaming to smart IoT. The launch immediately drew significant attention from attendees, becoming one of the highlights of the exhibition. Numerous industry customers and technology professionals stopped to experience the product firsthand and engaged in in-depth discussions, offering high praise for its all-scenario adaptability and core performance.

The TL322X series SoC is a true all-rounder in wireless connectivity. Featuring a dual-core 32-bit RISC-V architecture, it balances high-speed processing power with efficient energy consumption. It is fully compatible with multiple mainstream wireless protocols, including Bluetooth^® LE, Zigbee, Matter, and Thread, as well as the proprietary 2.4GHz protocol. It supports concurrent operation of multiple protocols such as Bluetooth, Zigbee, and Thread, and meets automotive-grade AEC-Q100 reliability certification requirements. Whether it’s the millisecond-precise control required in True 8K wireless gaming, the high demands for positioning accuracy and connection stability in asset tracking and car digital keys, or the daily intelligent interaction of smart homes and wearable devices, the TL322X series can handle it all with ease, providing a solid wireless connectivity core for various terminal devices. Furthermore, the series’ rich peripheral interfaces and comprehensive security mechanisms, from hardware encryption to secure boot, ensure comprehensive communication security, earning high praise from the audience for its development flexibility and reliability.

The ML3228A module deeply integrates the advantages of the TL322X series SoC, achieving greater integration while maintaining high performance and multi-protocol support. It offers abundant peripheral resources and outstanding power efficiency. With true out-of-the-box functionality that eliminates the need for complex secondary development, the module significantly lowers the R&D barrier and shortens development cycles—a key benefit highlighted by developers at the event. Many noted that the module effectively accelerates the journey from R&D to mass production. Designed specifically for IoT scenarios, the module is ideal for products demanding high wireless transmission speeds and low latency, such as esports keyboards, mice, and low-latency game controllers. It is also widely applicable in mainstream IoT terminals, including smart homes and wearable devices, providing developers with a one-stop, highly adaptable wireless module solution.

This simultaneous launch at the Embedded Systems trade fair in Germany marks a significant milestone in Telink’s strategic expansion within the wireless communication sector, establishing an integrated product system of “chip-level customized development + module-level plug-and-play.” This approach offers customers both flexible chip selection and convenient, ready-to-use module solutions. Supported by comprehensive development tools and SDKs, Telink’s robust technological foundation received unanimous recognition from attendees, with many expressing interest in further collaboration. Looking ahead, Telink will continue to focus on technological innovation, striving to deliver more stable, efficient, and secure wireless connectivity for a variety of smart terminals, while driving ongoing development of the intelligent interconnected ecosystem.

From delivering ultimate control in high-end esports to enhancing smart living in countless households, Telink remains committed to core technological innovation in wireless communication. Its presence at the Embedded Systems trade fair not only showcased the strength of Chinese semiconductor technology but also attracted global industry attention and acclaim with its competitive product portfolio, propelling the intelligent interconnected ecosystem toward higher-quality evolution.

Learn more: https://www.telink-semi.com/products/bluetooth-le/tl322x