Samtec Cable-to-Cable Interconnects Support High-Density AI Architectures



Samtec, Inc., the service leader in the connector industry, announces the release of the ARJ6 cable-to-cable, high-density panel mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec’s popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.

Cable-to-Cable

Samtec’s ARJ6 cable assembly mounts into a panel bracket (ARJ6-PB). When paired with Samtec’s ARP6 Series, the ARJ6 cable assembly enables cable-to-cable connection at the front panel, mid-plane or backplane, which eliminates the need to route signals through a PCB. The ARJ6-to-ARP6 cable-to-cable connection also uses direct-attach technology which removes the transition PCB inside the cable assembly housing and replaces it with high-density contacts that solder directly to the cable. Removing unnecessary PCBs at both the panel and within the connector assembly itself streamlines the signal path and improves impedance control, overall signal integrity and density.



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