EnSilica, a leading maker of mixed-signal application-specific integrated circuits (ASICs) and application-specific standard products (ASSPs), will showcase its custom silicon design and supply capabilities at electronica 2026, taking place in Munich from 10 to 13 November.
At Hall C6, Booth 679, visitors can explore how custom ASICs could address their design requirements with EnSilica’s specialists in mixed-signal, RF, mmWave and digital technologies. Discussions will span automotive, industrial, space and communications, and other applications where custom silicon offers advantages over standard components.
Custom ASICs allow designers to optimise integration, power, performance and functionality around specific system requirements, while reducing reliance on multiple standard components.
EnSilica takes customer ASICs from initial specification and architecture through design and qualification to manufacture and long-term volume supply. Visitors considering custom silicon can discuss the technical and commercial factors that shape an ASIC programme, including technology selection, integration, functional safety, security and connectivity, as well as the route from design to production.
Visitors can also hear about EnSilica’s latest developments and discuss how its design, engineering and supply expertise can support their own custom silicon requirements.
EnSilica will exhibit at electronica 2026, 10 to 13 November, in Hall C6, Booth 679.