We’ve got a new batch of renders for the upcoming Xperia 1 VIII, and they are our best look at the device yet. According to MyMobiles, we’re looking at the finalized design, and the source assures us they are based on the same CAD data used by Sony suppliers.
They depict a familiar design upfront with a tall and narrow-looking display with the front-facing camera integrated inside the top bezel next to the earpiece. Earlier renders suggested we might see a punch-hole cutout approach, but it seems that’s not going to be the case. The new renders suggest the bezel width will be unchanged from the Xperia 1 VII, and the new phone will likely retain its 6.5-inch OLED.
Based on the leaked dimensions, Xperia 1 VIII will measure 161.9 x 74.4 x 8.58 mm, which is similar to its predecessor but ever so slightly wider and thicker. That new square camera island will contribute to the phone’s overall thickness, which is said to reach 11.37 mm at its thickest point – a little over 2mm more than the Xperia 1 VII.
According to previous rumors, Sony is implementing this new design so it can fit larger-sized sensors compared to the ones found in the Xperia 1 VII, including a new telephoto sensor in the 1/3″ to 1/2″ size range. Apart from that, we also get a rumored launch for May with availability from June, just like last year’s model.