Flexiramics, a Netherlands-based materials company, will present its flexible ceramic material platform, Flexiramics®, at the IEEE International Microwave Symposium (IMS) 2026 in Boston. The company is positioning it as a potential alternative to glass fiber reinforcement in high-frequency electronic laminates. The showcase comes at a time when the electronics industry is actively reassessing material choices due to ongoing concerns around glass-fiber availability, supply stability, and long-term sourcing.
The Flexiramics material is a flexible ceramic nonwoven that integrates into standard laminate structures and manufacturing processes and is compatible with a wide range of resin systems. The company is also developing reinforced prepregs for multilayer electronics. Testing with Liquid Crystal Polymer (LCP) and Fluorinated Ethylene Propylene (FEP) shows dielectric performance comparable to glass, with a stable dielectric constant across 30–110 GHz, similar or lower loss tangent, and consistent behavior, supporting RF and millimeter-wave applications.
The material addresses thermal management, delivering up to 4× higher lateral heat dissipation than glass. It supports passive cooling in power electronics, improving reliability and reducing thermal stress. With alpha-alumina fibers, it provides higher thermal conductivity while maintaining insulation, strength, and high-temperature resistance, with ultra-thin variants stable up to ~800 °C for compact, high-temperature environments.
In industrial filtration, the material remains stable up to ~800 °C and resists harsh chemical conditions. With >90% porosity, it enables high airflow (up to 126 L/s/m² at 200 Pa) while maintaining efficiency—≥96.8% at 0.18 µm and ≥99.9% above 1.45 µm, along with strong liquid aerosol capture. It is PFAS-free and can be tailored with functional coatings. Its surface properties can also be modified with hydrophobic, hydrophilic, or catalytic coatings to support specific industrial use cases.
At IMS 2026, Flexiramics will be at Booth 13082 and is positioning this combination of properties as a flexible alternative to glass-based reinforcement in high-frequency electronic systems.