At IMS 2026, everything RF met Colin McClennan, Vice President of Evans Group, who highlighted the company’s range of high-reliability capacitor technologies designed for military, aerospace, medical, and other mission-critical applications. During the presentation, McClennan talked about products from Evans Capacitor, Paktron, and UTC, with particular focus on the company’s new Eulex Embedded Electrode Architecture RF Capacitor, a technology developed to deliver higher capacitance and lower losses in high-frequency RF systems.
Evans Group brings together several U.S.-based capacitor manufacturers that specialize in high-reliability electronic components. The company’s portfolio includes hybrid wet tantalum capacitors from Evans Capacitor, multilayer polymer film capacitors from Paktron, and multilayer ceramic capacitor technologies from UTC. These products are widely used in applications that demand long-term reliability and high performance under challenging operating conditions.
McClennan explained that Evans Capacitor’s hybrid wet tantalum capacitors offer high power density for applications operating in the 10 V to 125 V range. He also highlighted Paktron’s multilayer polymer film capacitor technology, which is constructed more like a multilayer ceramic capacitor than a traditional wound film capacitor. This design provides strong electrical performance in a lightweight and rugged package while offering self-healing characteristics that improve durability.
McClennan also talked about the Eulex Embedded Electrode Architecture RF Capacitor, which introduces a new approach to RF capacitor design. Traditional single-layer capacitors use electrodes placed on opposite sides of a dielectric material, with capacitance determined by electrode area and dielectric thickness. The Eulex architecture embeds an electrode within an internal dielectric layer, bringing it only microns away from the opposing electrode. This significantly reduces the effective dielectric thickness and delivers an order-of-magnitude increase in capacitance compared to conventional designs.
In addition to increasing capacitance, the architecture reduces losses by providing ultra-low equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor is available in a surface-mount package and eliminates the need for wire bonds, helping reduce inductance while also improving reliability. According to McClennan, the technology has been tested at frequencies of up to 110 GHz, making it suitable for demanding high-frequency RF and microwave applications.
Click here to learn more about Evans Group and its products.