Tomocube’s HT-T1D is a desktop holotomography system for high-resolution, non-destructive 3D defect analysis of glass substrates used in semiconductor packaging. It images internal defects and other fine features with a lateral resolution of 161 nm and an axial resolution of 1.298 µm.
Glass core substrates and glass interposers are gaining traction as key enabling materials for AI accelerators, high-bandwidth memory, and other advanced packaging applications. Manufacturers need to identify the root causes of micro-defects and quickly translate inspection data into process improvements.
The HT-T1D system applies visible-light holotomography to visualize the three-dimensional refractive-index distribution inside glass with refractive-index sensitivity down to ~10⁻⁴ Δn. Its non-destructive measurements enable repeated analysis of the same location across successive process stages, allowing users to track when and how defects form, propagate, or enlarge.
When conventional in-line panel inspection tools such as automated optical inspection (AOI) systems flag a potential defect, the HT-T1D uses the corresponding coordinates to reconstruct the interior of the glass substrate in three dimensions. It resolves the defect’s location, morphology, and depth profile that surface inspection alone cannot reveal.
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