2027 IEEE Electronic Components and Technology Conference Announces Call for Papers & Professional Development Courses



The 2027 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers. ECTC 2027 will take place June 1 to 4, 2027 at the Gaylord Rockies Resort & Convention Center in Denver, CO. More than 2,500 scientists, engineers and businesspeople from around the world are expected to attend.

Abstract submissions open on August 17, 2026 and the deadline for submissions is October 5, 2026. For complete details and to submit an abstract, please visit the ECTC 2027 Call for Papers.



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