Deep-tech pioneer LeapWave Technologies has been awarded the 15th KES Innovation Award in Electronic Components & Materials category at KES 2026 in Seoul for its TX500/RX500 sub-terahertz modules and LW C500 IC interface.
Designed to solve the critical high frequency I/O bottleneck in AI semiconductor packaging (CPO) and 6G telecommunications, LeapWave’s proprietary Dielectric Rod Waveguide (DRW) technology overcomes the limits of traditional high loss coaxial cables and multiband rectangular waveguides. Covered by six international patents, the single-connector interface delivers continuous, ultra-low loss (
“Our DRW technology provides the continuous physical layer required to scale next-generation continuous-span test and measurement equipment, and hybrid optical-electrical packaging,” said Muhsin Ali, RF Lead at LeapWave. “This recognition at KES, a major industrial forum in Asia, is an important milestone as we introduce our hardware to the market.”
LeapWave’s technology has been being validated through Joint Development Agreements (JDAs) with NTT, ROHM and Fraunhofer HHI, alongside participation in Europe’s €4.81M LUMINA 6G project with Thales, ETH Zurich and Telefónica. Following its market debut at EuMW 2026 in London and KES 2026 in Seoul, LeapWave will next exhibit at SEMICON Japan 2026 (Dec 9 to 11, Tokyo) as it expands its strategic presence across Asia. For more information, visit leapwavetech.com.