Defense-grade Agilex FPGAs and SoC FPGAs from Altera operate reliably in harsh environments across a temperature range of -55°C to +125°C. Leaded-ball and ruggedized packaging options are designed to withstand temperature cycling, vibration, and shock in mission-critical aerospace and defense applications.
The defense-grade devices will span Altera’s entire Agilex portfolio, from cost-optimized Agilex 3 FPGAs to mid-range Agilex 5 and high-performance Agilex 7 and Agilex 9 Direct RF-Series FPGAs. The portfolio addresses varying requirements for performance, power efficiency, and integration in applications ranging from embedded processing to high-bandwidth communications, sensing, and electronic warfare. A common architecture lets designers adapt their systems as mission requirements evolve.
Altera’s HyperFlex architecture uses Hyper-Retiming and Hyper-Pipelining to balance pipeline delays and shorten critical logic and routing paths. These techniques enable higher clock frequencies and greater processing throughput.
Fabrication in the United States provides a domestic source of wafer production, supporting supply-chain resilience for aerospace and defense programs with long service-life requirements.
Initial shipments of defense-grade Agilex FPGAs are scheduled for Q1 2027. Contact an Altera sales representative for additional information.
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